Exposure apparatus

ABSTRACT

An exposure apparatus includes a radiation system configured to supply a projection beam of radiation, and a patterning device configured to pattern the projection beam according to a desired pattern. The apparatus includes a substrate table having an area configured to support a substrate, and a projection system configured to project the patterned beam onto a target portion of the substrate. At least a part of the apparatus that during use of the apparatus is exposed to radiation is coated with a coating. The coating includes a metal oxide, or a photocatalyst, or a semiconductor, or any combination thereof.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. patentapplication Ser. No. 11/033,485, filed Jan. 12, 2005, which isincorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The inventions relate to coatings for exposure apparatus, a lithographicapparatus, a device manufacturing method, and a device manufacturedthereby.

2. Description of the Related Art

A lithographic apparatus is a machine that applies a desired patternonto a target portion of a substrate. Lithographic apparatus can beused, for example, in the manufacture of integrated circuits (ICs). Inthat circumstance, a patterning device, such as a mask, may be used togenerate a circuit pattern corresponding to an individual layer of theIC, and this pattern can be imaged onto a target portion (e.g. includingpart of one or several dies) on a substrate (e.g. a silicon wafer) thathas a layer of radiation-sensitive material (resist). In general, asingle substrate will contain a network of adjacent target portions thatare successively exposed. Known lithographic apparatus include steppers,in which each target portion is irradiated by exposing an entire patternonto the target portion in one go, and scanners, in which each targetportion is irradiated by scanning the pattern through the radiation beamin a given direction (the “scanning” direction) while synchronouslyscanning the substrate parallel or anti-parallel to this direction.

Although specific reference may be made in this text to the use oflithographic apparatus in the manufacture of ICs, it should beunderstood that the lithographic apparatus described herein may haveother applications, such as the manufacture of integrated opticalsystems, guidance and detection patterns for magnetic domain memories,liquid-crystal displays (LCDs) and other flat panel displays, thin-filmmagnetic heads, etc. It should be appreciated that, in the context ofsuch alternative applications, any use of the terms “wafer” or “die”herein may be considered as synonymous with the more general terms“substrate” or “target portion”, respectively. The substrate referred toherein may be processed, before or after exposure, in for example atrack (a tool that typically applies a layer of resist to a substrateand develops the exposed resist) or a metrology or inspection tool.Where applicable, the disclosure herein may be applied to such and othersubstrate processing tools. Further, the substrate may be processed morethan once, for example in order to create a multi-layer IC, so that theterm substrate used herein may also refer to a substrate that alreadycontains multiple processed layers.

The terms “radiation” and “beam” used herein encompass all types ofelectromagnetic radiation, including ultraviolet (UV) radiation (e.g.having a wavelength of 365, 355, 248, 193, 157 or 126 nm) and extremeultra-violet (EUV) radiation (e.g. having a wavelength in the range of5-20 nm), as well as particle beams, such as ion beams or electronbeams.

The term “patterning device” used herein should be broadly interpretedas referring to a device that can be used to impart a radiation beamwith a pattern in its cross-section such as to create a pattern in atarget portion of the substrate. It should be noted that the patternimparted to the radiation beam may not exactly correspond to the desiredpattern in the target portion of the substrate. Generally, the patternimparted to the radiation beam will correspond to a particularfunctional layer in a device being created in the target portion, suchas an integrated circuit.

Patterning devices may be transmissive or reflective. Examples ofpatterning devices include masks, programmable mirror arrays, andprogrammable LCD panels. Masks are well known in lithography, andinclude mask types such as binary, alternating phase-shift, andattenuated phase-shift, as well as various hybrid mask types. An exampleof a programmable mirror array employs a matrix arrangement of smallmirrors, each of which can be individually tilted so as to reflect anincoming radiation beam in different directions; in this manner, thereflected beam is patterned.

The support supports, e.g. bears the weight of, the patterning device.It holds the patterning device in a way depending on the orientation ofthe patterning device, the design of the lithographic apparatus, andother conditions, such as for example whether or not the patterningdevice is held in a vacuum environment. The support can use mechanicalclamping, vacuum, or other clamping techniques, for exampleelectrostatic clamping under vacuum conditions. The support may be aframe or a table, for example, which may be fixed or movable as requiredand which may ensure that the patterning device is at a desiredposition, for example with respect to the projection system. Any use ofthe terms “reticle” or “mask” herein may be considered synonymous withthe more general term “patterning device”.

The term “projection system” used herein should be broadly interpretedas encompassing various types of projection system, including refractiveoptical systems, reflective optical systems, and catadioptric opticalsystems, as appropriate for example for the exposure radiation beingused, or for other factors such as the use of an immersion fluid or theuse of a vacuum. Any use of the term “lens” herein may be considered assynonymous with the more general term “projection system”.

The illumination system may also encompass various types of opticalcomponents, including refractive, reflective, and catadioptric opticalcomponents for directing, shaping, or controlling the radiation beam ofradiation, and such components may also be referred to below,collectively or singularly, as a “lens”.

The lithographic apparatus may be of a type having two (dual stage) ormore substrate tables (and/or two or more mask tables). In such“multiple stage” machines the additional tables may be used in parallel,or preparatory steps may be carried out on one or more tables while oneor more other tables are being used for exposure.

The lithographic apparatus may also be of a type wherein the substrateis immersed in a liquid having a relatively high refractive index, e.g.water, so as to fill a space between the final element of the projectionsystem and the substrate. Immersion liquids may also be applied to otherspaces in the lithographic apparatus, for example, between the mask andthe first element of the projection system. Immersion lithography ismentioned in, for example, U.S. Patent Application Publication No.2004/0119954 A1 and WO 2004/093610.

Use of a liquid, however, may result in stains on, for example, theprojection system, the substrate holder, or other parts in the vicinityof the liquid or possible vapors emanating from the liquid. For example,stains may be left on sensors, for example transmission image sensors(TIS) that may be present on the substrate holder, which could lead toinaccuracies in, e.g., aligning a wafer with a mask and/or to adecreased lifetime of these sensors. An aspect of the present inventionis to reduce or eliminate the risk of staining on the various parts ofthe exposure apparatus by the immersion liquid.

Other problems that may arise in exposure apparatus in general is thedeposition of contaminants on various parts of the apparatus, forexample sensors. Such contaminants may originate from, e.g., outgassingby the photoresist that may be present on the substrate or fromcomponents present in the ambient air (including components formed inthe ambient air under the influence of the radiation generated by theexposure apparatus). Outgassing may be of particular concern in extremeultraviolet (EUV) lithography. EUV lithography is mentioned in, e.g.,U.S. Pat. No. 6,724,462. The EUV radiation may assist in crackinghydrocarbons that enter the atmosphere as a result of the outgassing,which in turn may lead to undesirable deposition of carbon on nearbysurfaces.

Deposition of contaminants may, depending on the location of thedeposition, lead to concerns relating to, e.g., the lifetime of variousapparatus parts, alignment, leveling, sensor grating deterioration,and/or radiation blocking. An aspect of the present invention is toreduce or eliminate the deposition of contaminants on the various partsof the exposure apparatus.

SUMMARY

The present invention provides coatings for use in an exposureapparatus, for example for coating a sensor on a substrate table. Thecoating may have a contact angle with water of less than 10°. Thecoating may have photocatalytic activity, for example a coatingincluding a semiconductor photocatalyst. The coating may include asemiconductor. The coating may also include a metal oxide.

The invention further provides sensors including a protective coating,for example the above-noted coatings.

The present invention also provides lithography apparatuses andlithography methods.

Additional aspects and features of the present invention are set forthin this specification.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention will now be described, by way ofexample only, with reference to the accompanying schematic drawings inwhich corresponding reference symbols indicate corresponding parts, andin which:

FIG. 1 depicts a lithographic apparatus according to an embodiment ofthe present invention; and

FIG. 2 depicts an embodiment of a substrate table according to thepresent invention.

DETAILED DESCRIPTION

FIG. 1 schematically depicts a lithographic apparatus according to anembodiment of the present invention. The apparatus includes anillumination system (illuminator) IL configured to condition a radiationbeam PB (e.g. UV radiation); a first support (e.g. a mask table) MTconfigured to support a patterning device (e.g. a mask) MA and connectedto a first positioning device PM (e.g. including at least one rotary,linear, or planar motor) that accurately positions the patterning devicewith respect to item PL; a substrate table (e.g. a wafer table) WTconfigured to hold a substrate (e.g. a resist-coated wafer) W andconnected to a second displacement (positioning) device PW (e.g.including at least one rotary, linear, or planar motor) that accuratelypositions the substrate with respect to a projection system PL (e.g. arefractive projection lens) PL configured to image a pattern imparted tothe radiation beam PB by patterning device MA onto a target portion C(e.g. including one or more dies) of the substrate W.

As here depicted, the apparatus is of a transmissive type (e.g.employing a transmissive mask). Alternatively, the apparatus may be of areflective type (e.g. employing a programmable mirror array of a type asreferred to above).

The illuminator IL receives radiation from a radiation source SO. Thesource and the lithographic apparatus may be separate entities, forexample when the source is an excimer laser. In such cases, the sourceis not considered to form part of the lithographic apparatus and theradiation is passed from the source SO to the illuminator IL with theaid of a beam delivery system BD including for example suitabledirecting mirrors and/or a beam expander. In other cases the source maybe integral part of the apparatus, for example when the source is amercury lamp. The source SO and the illuminator IL, together with thebeam delivery system BD, if required, may be referred to as a radiationsystem.

The illuminator IL may include an adjusting device AM configured toadjust the angular intensity distribution of the beam. Generally, atleast the outer and/or inner radial extent (commonly referred to asσ-outer and σ-inner, respectively) of the intensity distribution in apupil plane of the illuminator can be adjusted. In addition, theilluminator IL generally includes various other components, such as anintegrator IN and a condenser CO. The illuminator provides a conditionedbeam of radiation PB having a desired uniformity and intensitydistribution in its cross-section. In an embodiment, the radiation has awavelength of at least 5 nm, e.g. at least 100 nm, at least 125 nm, atleast 150 nm, at least 190 nm, or at least 220 nm. In an embodiment, theradiation has a wavelength of at most 400 nm, e.g. at most 365 nm, atmost 300 nm, at most 260 nm, at most 200 nm, at most 150 nm, at most 100nm, at most 50 nm, or at most 20 nm.

The radiation beam PB is incident on the mask MA, which is held on themask table MT. Having traversed the mask MA, the radiation beam PBpasses through the projection system PL, which projects the beam onto atarget portion C of the substrate W. With the aid of the secondpositioning device PW and a measurement device (position sensor) IF(e.g. an interferometric or capacitive device and/or encoder), thesubstrate table WT can be moved accurately, e.g. so as to positiondifferent target portions C in the path of the beam PB. Similarly, thefirst positioning device PM and another position sensor (which is notexplicitly depicted in FIG. 1 but which may be an interferometric orcapacitive device and/or encoder)) can be used to accurately positionthe mask MA with respect to the path of the beam PB, e.g. aftermechanical retrieval from a mask library, or during a scan. In general,movement of the object tables MT and WT will be realized with the aid ofa long-stroke module (coarse positioning) and a short-stroke module(fine positioning), which form part of the positioning devices PM andPW. However, in the case of a stepper, as opposed to a scanner, the masktable MT may be connected to a short stroke actuator only, or may befixed. Mask MA and substrate W may be aligned using mask alignment marksM1, M2 and substrate alignment marks P1, P2.

The depicted apparatus can be used in the following preferred modes:

1. In step mode, the mask table MT and the substrate table WT are keptessentially stationary, while an entire pattern imparted to theradiation beam is projected onto a target portion C at once (i.e. asingle static exposure). The substrate table WT is then shifted in the Xand/or Y direction so that a different target portion C can be exposed.In step mode, the maximum size of the exposure field limits the size ofthe target portion C imaged in a single static exposure.

2. In scan mode, the mask table MT and the substrate table WT arescanned synchronously while a pattern imparted to the radiation beam isprojected onto a target portion C (i.e. a single dynamic exposure). Thevelocity and direction of the substrate table WT relative to the masktable MT is determined by the (de-)magnification and image reversalcharacteristics of the projection system PL. In scan mode, the maximumsize of the exposure field limits the width in the non-scanningdirection of the target portion in a single dynamic exposure, whereasthe length of the scanning motion determines the height in the scanningdirection of the target portion.

3. In another mode, the mask table MT is kept essentially stationaryholding a programmable patterning device, and the substrate table WT ismoved or scanned while a pattern imparted to the radiation beam isprojected onto a target portion C. In this mode, generally a pulsedradiation source is employed and the programmable patterning device isupdated as required after each movement of the substrate table WT or inbetween successive radiation pulses during a scan. This mode ofoperation can be readily applied to maskless lithography that utilizesprogrammable patterning device, such as a programmable mirror array of atype as referred to above.

Combinations and/or variations on the above described modes of use orentirely different modes of use may also be employed.

FIG. 2 shows an embodiment of a substrate table WT. In the embodimentshown in FIG. 2, two sensors TIS1 and TIS2 are mounted on a fiducialplate mounted to the top surface of the substrate table WT at diagonallyopposite positions outside the area covered by the substrate W. Thefiducial plate may be made of a highly stable material with a very lowcoefficient of thermal expansion, e.g. INVAR®, and has a flat reflectiveupper surface which may carry markers used in alignment processes.Sensors TIS1 and TIS2 are used to determine directly the vertical andhorizontal position of the aerial image of the projection system. Theyinclude apertures in the respective surface close behind which is placeda photodetector sensitive to the radiation used for the exposureprocess. To determine the position of the focal plane, the projectionsystem projects into space an image of a TIS pattern TIS-M provided onthe mask MA and having contrasting light and dark regions. The substratetable is then scanned horizontally in one or two directions andvertically so that the aperture of the TIS passes through the spacewhere the aerial image is expected to be. As the TIS aperture passesthrough the light and dark portions of the image of the TIS pattern, theoutput of the photodetector will fluctuate. The vertical level at whichthe rate of change of amplitude of the photodetector output is highestindicates the level at which the image of TIS pattern has the greatestcontrast and hence indicates the plane of optimum focus. An example of aTIS of this type is described in greater detail in U.S. Pat. No.4,540,277. Instead of the TIS, a Reflection Image Sensor (RIS) such asthat described in U.S. Pat. No. 5,144,363 may also be used. The TISsurface may additionally carry reference markers whose position isdetected using a through-the-lens (TTL) alignment system to align thesubstrate table to the mask. Such an alignment system is described inU.S. Pat. No. 5,481,362, for example. Alignment of individual exposureareas can also be carried out, or may be obviated by an alignmentprocedure carried out at the measurement stage to align the exposureareas to the reference markers on the wafer stage. Such a procedure isdescribed in U.S. Pat. No. 6,297,876, for example.

As noted earlier, use of a liquid, such as in immersion lithography, mayresult in stains on parts in an exposure apparatus, for example onsensors, e.g. transmission image sensors. Other problems that may arisein exposure apparatus in general is the deposition of contaminants fromthe ambient atmosphere on various parts of the apparatus.

In an embodiment, the present invention provides coatings for parts ofan exposure apparatus, for example parts of the projection system orparts of the substrate table. In an embodiment, the coatings are used onone or more parts that are exposed to radiation during operation of theapparatus. In an embodiment, the present coatings are used for sensors,for example aberration sensors, radiation dose sensors, transmissionimage sensors, and/or reflective image sensors. In an embodiment, forexample when the coating is used in an immersion lithography apparatus,the coating is exposed to a liquid, e.g. an aqueous liquid, for examplewater, during operation of the apparatus.

In an embodiment, the present coating includes one or morephotocatalysts, for example titanium dioxide and/or zinc oxide. In anembodiment, the photocatalytic coating assists in breaking upcontaminants that are deposited on the coating. In an embodiment, thecoating includes, relative to the total weight of the coating, at least25 wt % of one or more photocatalysts, for example at least 50 wt %, atleast 75 wt %, at least 90 wt %, or at least 95 wt %. In an embodiment,the coating includes one or more photocatalysts, e.g. TiO₂.

In an embodiment, the present coating is hydrophilic and has a watercontact angle of less than 15°, for example less than 10°, less than 8°,less than 6°, less than 3°, or about 0°. Water contact angles may bedetermined with a FTA 200 Dynamic Contact Angle Analyser (available fromCamtel LTD, Elsworth, Cambridgeshire, UK) at room temperature.Hydrophilic coatings may avoid staining of the coated parts by anaqueous liquid in, for example, immersion lithography. The hydrophiliccoating may prevent the formation of droplets and thereby preventcontaminants that may be present in the liquid from flowing to andconcentrating around the perimeter of a droplet. The hydrophilicity ofthe coating may be photoinduced hydrophilicity (e.g. as a result ofbeing or having been exposed to UV radiation) and may have a watercontact angle of, for example, greater than 15° (e.g. greater than 20°)prior to invoking the photoinduced hydrophilicity. In an embodiment, thephotoinduced hydrophilicity may be reversible (e.g., the coating mayreturn to its comparatively hydrophobic state after not having receivedradiation for a certain period of time). In an embodiment, thehydrophilic coating is a titanium dioxide coating.

In an embodiment, the coating includes one or more metal oxides, forexample titanium dioxide, zinc oxide, and/or zirconium dioxide. In anembodiment, the coating includes, relative to the total weight of thecoating, at least 25 wt % of one or more metal oxides, for example atleast 50 wt %, at least 75 wt %, at least 90 wt %, or at least 95 wt %.In an embodiment, the coating consists essentially of one or more metaloxides, for example TiO₂, SrTiO₃, Fe₂O₃, ZnO, ZrO₂, WO₃, or mixturesthereof.

In an embodiment, the present coating includes one or moresemiconductors, for example TiO₂, SrTiO₃, Fe₂O₃, WO₃, CdS, or mixturesthereof. In an embodiment, the coating includes, relative to the totalweight of the coating, at least 25 wt % of one or more semiconductors,for example at least 50 wt %, at least 75 wt %, at least 90 wt %, or atleast 95 wt %. In an embodiment, the coating includes one or moresemiconductors. In an embodiment, the semiconductors are semiconductorphotocatalysts.

The coating may be provided on a substrate by any suitable method orprocess. In an embodiment, the coating is applied by reactive magnetronsputtering. In another embodiment, the coating is applied by spincoating or dip coating. In an embodiment, the substrate is a glasssubstrate (e.g. a glass substrate that is partly coated with a metal,e.g. chromium) or a metal halide (e.g., CaF₂) substrate.

The coating may have any suitable thickness. In an embodiment, thethickness of the coating is at least 1 nm, for example at least 3 nm, atleast 7 nm, at least 15 nm, at least 30 nm, at least 50 nm, at least 75nm, at least 100 nm, at least 150 nm, or at least 250 nm. In anembodiment, the thickness of the coating is less than 10 μm, for exampleless than 7 μm, less than 4 μm, less than 2 μm, less than 1 μm, lessthan 750 nm, less than 500 nm, or less than 350 nm.

Having described specific embodiments of the present invention, it willbe understood that many modifications thereof will readily appear or maybe suggested to those skilled in the art, and it is intended thereforethat this invention is defined by the following claims.

1. An exposure apparatus comprising: a radiation system configured tosupply a projection beam of radiation; a patterning device configured topattern the projection beam according to a desired pattern; a substratetable having an area configured to support a substrate; a projectionsystem configured to project the patterned beam onto a target portion ofthe substrate; wherein at least a part of the apparatus that during useof the apparatus is exposed to radiation is coated with a coating, thecoating comprising a metal oxide, or a photocatalyst, or asemiconductor, or any combination thereof.
 2. The apparatus of claim 1,wherein said part includes one or more sensors selected from the groupconsisting of aberration sensors, radiation dose sensors, transmissionimage sensors, or reflective image sensors.
 3. The apparatus of claim 2,wherein said at least part of said substrate support includes one ormore transmission image sensors.
 4. The apparatus of claim 1, whereinsaid coating comprises one or more metal oxides.
 5. The apparatus ofclaim 1, wherein said coating comprises one or more photocatalysts. 6.The apparatus of claim 1, wherein said coating comprises one or moresemiconductors.
 7. The apparatus of claim 1, wherein said coatingcomprises titanium dioxide.
 8. The apparatus of claim 1, wherein saidcoating comprises, relative to the total weight of said coating, atleast 50 wt % titanium dioxide.
 9. The apparatus of claim 1, whereinsaid apparatus is an immersion lithography apparatus.
 10. The apparatusof claim 1, wherein said projection beam of radiation has a wavelengthin the range of 5-20 nm.
 11. The apparatus of claim 1, wherein saidcoating has a thickness of less than 10 μm.
 12. The apparatus of claim1, wherein said coating has a thickness in the range of 50-500 nm. 13.The apparatus of claim 1, wherein a portion of the coating is exposed toa liquid during use.
 14. The apparatus of claim 1, wherein the part ofthe apparatus which is coated is configured so that a portion of thecoating contacts liquid during use.
 15. A device manufacturing processcomprising exposing a substrate to radiation with the apparatusaccording to claim 1.